Rochester Electronics Blog

Courtney Vidachek

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Intern of the Week: Courtney Videchak

Posted By Christina Gerrish on Jul 22, 2015

Here are a few words from our intern of the week. After graduating from Haverhill High School in June, I will be attending Merrimack College in the fall with a major in Mechanical Engineering in the Honors Program. I am lucky to take on a role many students do not have opportunity to participate in [...]

Dip

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I Dip, You Dip, We Dip? Not for long…..

Posted By Dan Deisz on Jul 21, 2015

The famous DIP (Dual In-Line) package is quickly making a final bow as an active device packaging solution for semiconductors. Over the next 2 years, the biggest semiconductor companies in the world are saying goodbye to this packaging solution and some already have. Since 1964, the DIP package has been a mainstay for low-complexity logic. In 1976, [...]

Connor Morrison

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Intern of the Week: Connor Morrison

Posted By Christina Gerrish on Jul 15, 2015

Here are a few words from our intern of the week. Believe it or not, my decision to intern at Rochester Electronics was not only based on the “quality time” I would get to spend commuting with my step dad for an hour and a half each day. My original reasoning came down to a [...]

Protection and Preservation of

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Why Protect & Preserve Semiconductor Design IP?

Posted By Teresa Powell on Jul 14, 2015

Intellectual Property or IP is one of the cornerstones of the semiconductor industry. It is a precious commodity that can determine a company’s ability to amass and retain market share in a specific domain. Companies go to great lengths to protect their IP and preserve it as an on-going resource. To ensure the long-term availability [...]

Noah

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Intern of the Week: Noah Tanguay-Collins, Online Marketing Team

Posted By Christina Gerrish on Jul 8, 2015

I am a junior at Endicott College majoring in Business with a concentration in Marketing.  Rochester Electronics was of great interest to me due to its competitive history, ingenuity and expectations for excellence.  I am eager to learn from high quality professionals and be exposed to the marketing and branding strategies of Rochester Electronics. I [...]

#ViewFromMyDesk icon

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#ViewFromMyDesk

Posted By Christina Gerrish on Jul 7, 2015

Join us as we share photos from our Rochester employees who have sent us the view from their workspaces across the globe. In the past decade, Rochester has grown significantly. From expansion into new regions in Asia, Europe, North America (basically transforming into a global corporation), to ground breaking manufacturing solutions and eCommerce, to new [...]

PDCA image

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PDCA Planning in an HMLV Environment

Posted By Loren Krott on Jun 30, 2015

We have all  heard of PDCA, the “Plan, Do, Check, Act” cycle made popular by Demming and Shewhart when the foundation of modern quality systems was formed.  Some say that this process can actually track back to the scientific method processes developed by Bacon in the 1600′s, showing that it has been a very tried [...]

Untitled design (5)

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Die Attach Considerations for High Mix Semiconductor Assembly

Posted By Steve Shermer on Jun 17, 2015

Efficiency and flexibility are the keys when your assembly business model calls for multiple product types, and multiple part numbers within products at volumes that does not warrant a dedicated assembly line.  Below are some considerations for the die attach operation: 1.  Equipment Selection Capital investments can add up quickly.  Knowing what packages types are [...]

IXF_7oct13

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Solving FPGA Obsolescence Challenges through Re-Design – FPGA to Gate Array Conversion

Posted By John Mastropietro on Jun 11, 2015

Over the past several years we have seen the major FPGA vendors move away from the support of 5V and 3.3V Field Programmable Gate Array (FPGA) Technologies.   This has left many designers faced with common questions and challenges as they look to move older design technologies forward.  Should costly Last Time Buys be made?  Is [...]