Rochester Electronics Blog

Posts For » 2014 » February

inventory

In Featured

Before and After Market (BAM) Blog: chip makers respond to mil-spec market pressures

Posted By George Karalias on Feb 25, 2014

Rochester Electronics participates in a guest blog hosted on Military Embedded Systems’ website.  Our latest blog addresses the shift from mil-spec to COTS, which has created difficulty for military contractors. As mentioned in this blog, “Military equipment requires devices that can withstand extreme temperatures — and other environmental extremes. The old mil temperature range of -55 [...]

Environmental Lab HI-REL Blog image

In Featured

Why Purchasing Hi-Rel Components the Right Way Matters

Posted By George Karalias on Feb 21, 2014

Before you begin diving into this blog piece, take a moment to step out of your comfort zone and into the shoes of military personnel who has found themselves on the front-line of battle. This specific person you have become has been using mission-critical equipment that must operate under some of the most severe conditions [...]

RE square logo

In Featured

Join Rochester at Embedded World 2014 in Nurnberg, Germany!

Posted By George Karalias on Feb 20, 2014

Rochester Electronics representatives from our Central European and North American offices will be hosting booth number 4A-231 at this year’s Embedded World Exhibition and Conference being held in Nurnberg, Germany! The show will be held from February 25th-27th at the Nuremberg Exhibition Center, and will provide the embedded community with the opportunity to experience and [...]

87C51BQA

In Featured

PRESS RELEASE: Rochester Electronics Expands Support of Obsolete and Active MIL-STD-883 and MIL-PRF-38535 Integrated Circuits

Posted By George Karalias on Feb 12, 2014

February 12, 2014 Rochester Electronics Expands Support of Obsolete and Active MIL-STD-883 and MIL-PRF-38535 Integrated Circuits Newburyport, MA – February 12, 2014 – Rochester Electronics has expanded its continuing manufacturing and support services of obsolete and active MIL-STD-883 and MIL-PRF-38535 integrated circuits for military and aerospace applications. Through its Extension-of-Life ® products and solutions, Rochester [...]

RE square logo

In Featured

Guest Blog: EETimes – Semiconductor Packaging Is No Longer ‘Standard’

Posted By George Karalias on Feb 11, 2014

Marketing and Communications Director, George Karalias, guest blogged recently on EETimes.com, an industry-leading publication. His blog discussed how “standard packaging” has become obsolete, and original component manufacturers (OCM) such as Intel and TI and are turning implementing custom substrates for flip-chip BGA packaging technologies into their leading processors. As taken from this guest blog: “Do [...]

RE square logo

In Featured

ROCHESTER ELECTRONICS ENTERS INTO A CONTINUING SOURCE AGREEMENT WITH RENESAS

Posted By George Karalias on Feb 6, 2014

FOR IMMEDIATE RELEASE February 5th, 2014                                                    Rochester Electronics selected as authorized continuing source for Renesas discontinued products… ROCHESTER ELECTRONICS ENTERS INTO A CONTINUING SOURCE AGREEMENT WITH RENESAS  Newburyport, MA, February 5th, [...]