Our IC prototyping services keep your business moving

Manufacturing OCPRochester Electronics provides a broad range of OCPs for IC prototyping, enabling quicker time-to-market for new product introductions.

Our Newburyport, MA, facilities have over 160,000 square feet of cleanroom space available to support both plastic and hermetic assembly services.

OCPs are ideal for R&D or pre-production environments and represent a cost-effective solution for low volume prototypes. Typical applications include RF/Microwave, MEMs, Sensors, and Power electronics.

Rapid Prototype Capabilities Include:

  • Variety of standard package types including QFNs (3x3 mm to 8x8 mm) and an extensive range of custom solutions.
  • Encapsulation services with a wide variety of package lids
  • Reliability Testing to JEDEC Standards

Assembly Services Include:

  • Wafer Back-grind (currently 200mm silicon wafers
  • Wafer Dicing (currently 200mm silicon wafers
  • Die Attach
  • Wire Bonding
  • Laser Marking

 

Learn more about our Manufacturing Services.

 

Contact us with your requirements.

 

 

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