Did you know that Rochester offers RF Assembly and Test Services as part of our manufacturing services?
Rochester has experience in custom assembly for RF and Microwave products. A recent program included a GaAs MMIC chip attach into LCC (Leadless Chip Carrier) packages using conductive epoxy. Rochester’s engineers successfully implemented wire bond techniques with minimal wire lengths to yield repeatable performance up to 30GHz.
Also, we offer in-house RF Test facilities which include spectrum analysis up to approx. 2GHz and a full suite of S-Parameter testing up to 3GHz. Contact us about your RF/Microwave Test requirements as we have the ability to upgrade our capabilities to higher frequencies.
Rochester Electronics is registered to manufacture ITAR products.